DB03 Fanless Embedded Pc hmanga siam a ni

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DB03 Fanless Embedded Pc hmanga siam a ni
Kimchang
-OEM&ODM supported a ni
-Windows/Linux/Android system hmanga siam a ni
-Intel 7th/10th/12th/J6412/N97-ah chuan a hlawhtling hle
-6*COM (COM1-COM4 hian RS232/RS485 switching a support a, COM5-COM6 hian RS232 a support bawk)
-2 * USB 3.0+6 * USB 2.0 hmanga siam a ni
-8*GPIO a ni
-DC12V input,DC9-36V duhthlan theih a ni
Bithliahna
Industrial Embedded PC hmanga siam a ni
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Hrilhfiahna

A chiang zawk

Processor a ni

J6412/N97/Core (I3/I5/I7) 7th/10th/12th generation U series high-performance processor te a support a, Andorid system tan RK3568/RK3576/RK3588 a support bawk

BIOS hmanga siam a ni

AMI UEFI BIOS hmanga siam a ni

Hriatrengna

1/2 * laptop memory card dahna tur a awm

7th generation series hian 32G thleng a support a, 10th/12th generation series hian 64G thleng a support bawk.

Tarchhuak

Integrated Intel® Hyper-GPU Dual HDMI leh VGA port a support a, a display resolution sang ber chu 3840x2160 a ni.

Hard disk a ni

1 * M.2 2280 SSD card dahna tur a awm

1 * 2.5 inch, hard disk awmna (a duh duh)

Wireless hmanga siam a ni

1 * Mini-PCIE slot, 4G/5G module a support (a duh chuan)

1 * MINI-PCIE seat (4G module a support)

Hma lam panel IO

1 * 2PIN Phoenix terminal, 12V voltage input support, 9-36V zau voltage input duhthlan tur a ni

2 * HDMI a ni

2 * USB 3.0+6 * USB 2.0 hmanga siam a ni

4 * LAN a ni

8 GPIO (digital input leh output pe thei) + SW (start button pawn lam interface) .

1*Type-C (data thawn chhuahna atan)

 

Hnung lam panel IO

2 * WIFI antenna khur a awm

1* Push button switch ah hian indicator light a awm

1* Audio chhuahna/microphone aw input (integrated) a awm thei.

1*SIM card dahna tur a awm

1*VGA a ni

6*COM (COM1-COM4 hian RS232/RS485 switching a support a, COM5-COM6 hian RS232 a support bawk)

1* CMOS Clear button (BIOS settings a clear thei a, factory default state-ah a awm leh thei)

Operating System hmanga hnathawh dan

Windows 10/Windows 11/Linux hmanga siam a ni

Hnathawh dan lum leh vawt

-10℃-60℃a ni

A dahna temperature a ni

-20℃-75℃a ni

A duh chuan configuration a awm thei

I3/I5/I7 7th generation CPU a ni

I3/I5/I7 10th generation CPU a ni

I3/I5/I7 12th generation CPU a ni

J6412 CPU a ni

Andorid system atan N97 CPU/Leh RK3568/RK3576/RK3588 a ni

 

Jorarri Industrial Embedded PC: Industrial/Outdoor Edge Deployment hrang hranga hman theih turin Rugged Computer chu a duh angin a siam danglam theih

 

01

Fanless Design chak tak & Temperature zau tak laka inven theihna

Fanless, dust-proof structure hmanga siam niin, he industrial embedded PC hian industrial environment harsa takah rintlak takin a thawk a ni. -20℃atanga 70℃thlenga temperature range zau tak a support a, overheating emaw component failure emaw awm lovin, dusty, high-vibration, emaw extreme-temperature workspace-ah pawh performance nghet tak a siam thei a ni.

02

Memory & Storage tihpun theih a ni

Flexible memory leh storage expansion pein, he industrial PC hian 32GB DDR4 RAM thleng leh SSD/HDD storage interface tam tak a support a ni. Data storage lian tak tak leh memory-intensive industrial application awlsam takin a dah thei a, computing mamawh danglam zel atan scalable performance a pe thei a ni.

 

03

Security tihchangtlun & Industrial OS nghet tak a ni

Hardware-level security features (TPM 2.0 ang chi) leh stable industrial operating systems (Windows/Linux/Android) support hmanga thuam, he embedded PC hian industrial data pawimawh tak tak a humhim a, hun rei tak-term system stability a tichiang bawk. Downtime leh security risk a tihtlem avangin mission-critical industrial automation leh edge computing scenario atan a tha hle.

01 2

 

02 2

All-aluminum enclosure rugged hmanga siam niin, he industrial PC hian environment adaptability danglam tak a pe a ni. Tui tlak loh, leivut laka him lo, corrosion-resistant, leh seismic-pressure resistant a ni a, industrial setting harsa takah pawh rintlak taka performance a tichiang a ni.

03 2

Fanless chassis design hian heat dissipation tha tak, muang tak a pe a ni. Part che thei lovin stable, zero-noise operation a siam thei a, a tha zawngin overheating a veng a, extreme temperature condition-ah pawh performance chhunzawm zel a tichiang bawk.

04

Fanless structure fully enclosed a nei a, he industrial PC hi dust-proof leh anti-interference a ni. A cable-free design hian hlawhchhamna a ti tlem a, industrial environment harsa ber berte pawhin hun rei tak-stable operation a phalsak a ni.

05

Thil siam chhuah dan (Product Structure) a ni

He industrial PC hian a compact, fanless all-aluminum structure a nei a, a dimension pawh a dik hle. A modular design hian space-constrained industrial environment-ah awlsam taka integration leh stable performance a siamsak a ni.

06

I/O Port tam tak a awm

I/O port hausa tak tak nen thuam a ni a, chung zingah chuan 4RJ45, 6-ah a awmCOM, HDMI, VGA, DP, 8*USB leh Mini PCIe te a ni a, industrial device leh application hrang hrang mamawh phuhruk turin connectivity flexible tak a pe a ni.

07

Interface hrang hrang a awm

Interface tihzauh theih a nih avangin he industrial PC hian pawn lam device tam zawkah pawh flexible takin a connect thei a, smart home, street light, access control leh agricultural irrigation scenario-ah te a hmanna a tizau thei a ni.

 

08

He industrial PC hian scenario hrang hrangah a hlawhtling hle a: medical system, smart factory, intelligent transportation, agricultural irrigation control, street light management, leh weather monitoring, industry hrang hrangah performance rintlak tak a pe chhuak a ni.

09

 

 
 
 
 
 
Kan custom industrial motherboard te hian temperature/voltage support zau tak, EMC anti-interference, leh anti-static design te a pe a. Android/Windows an hmang a, industrial mamawh atan CPU/storage option flexible tak tak an nei bawk.

 

 

 

 

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