A chiang zawk

Entawn tlak	H110-OPS A03 D3 tih a ni
Chipset a ni	Intel ® H110 Express a ni
CPU a ni	Intel 6/ 7/ 8/ 9/ 10/ 11/ 12/ 13/ 14th generation desktop processor hmanga siam a ni
CPU a ni	(6100/ 6400/ 6700/ 7100/ 7400/ 7500/ 7700/ 8100/ 8400/ 8700/ 9100/ 9400/ 9700)
Hriatrengna	1X SO-DIMM DDR3 (16GB thleng a support)
Dahthatna	1 mSATA, 1 7PIN SATA inzawmna
WIFI a awm bawk	Default 2.4G onboard WIFI, duhthlan theih M.2 2.4G/ 5G dual-band WIFI + Bluetooth
USB hmanga siam a ni	A hmalam chu USB3.0 x 3, USB2.0 x 3, OPS tawp 2 x USB2.0, 1 x USB3.0 interface a ni
USB hmanga siam a ni	Hma lam atanga chhuak: 1xHDMI 1.4 3840x2160 4k30Hz
Display interface a ni	1xVGA 1920x1080@60Hz ah a awm a
Display interface a ni	JAE terminal: 1xHDMI 2.0 3840x2160 4k60Hz a ni
COM port ah a awm	Board hian COM port pin 1 a pe a, RS23 a support a, OPS terminal hian serial port function a support bawk (RS232 a support thei bawk). TTL default a ni
Network port ah a awm a	A chhungah hian RTL8111H Gigabit network interface card a awm a, standard RJ45 interface 1 10M/ 100M/ 1000M adaptive a ni
Audio hmanga siam a ni	A chhungah hian high definition sound card, audio output (green), MIC input (pink) te a awm a.
Chenna khawvel	A hnathawhna hmun: 0-50℃; A dahna hmun: -20~ 70℃;
Chenna khawvel	Hnathawh humidity: 5%~ 95%, condensation awm lo; Storage humidity: 5%~ 95%, condensation awm lo
Chassis size a ni	195 * 180 * 30/ 33/ 42 MM (a thuk zawng duhthlan theih)

OPS Computer: Smart Board hrang hrang tan Compact High-Performance Module a ni

He pluggable mini-computing unit hi smart board integration atan bik engineer a ni a, Windows OS seamless taka hnathawh theihna a ni.

Space-saving form factor, hassle-free plug-and-play deployment, leh processing theihna nghet tak a nei a, multitasking mumal tak, application launching rang tak, leh lag-free collaboration tool utilization te a support a ni.

Smart board model tam zawka inmilna zau tak, RAM/storage upgradeability awlsam tak, leh interface suite kimchang tak neiin, he rintlak, space-efficient Windows solution hian interactive teaching, corporate conferencing, leh presentation workflows a tichak a ni.

Jorarri OPS plug and play without drivers

Plug-leh-Play, Driver nei lo Architecture hmanga siam a ni

Plug dik tak-leh-play functionality-driver install dan buaithlak tak takte tihbo nan smart board integration seamless tak neih theihna tura engineer a ni. Instant activation a siam a, zirna hmun, corporate office, leh conference neihna hmun hrang hranga rollout chak taka kalpui theihna turin deployment workflow a ti awlsam bawk.

Standardized Connectivity & Enterprise-Grade himna tur a ni

Universal interface standardization a chhuang a, smart board system te nen pawh seamless interoperability a siam thei a ni. Encryption protocol built-in, secure boot functionality, leh security patch rollouts regular tak tak hmanga thuam a ni a, mission-critical enterprise workflows atan data venhimna nghet tak leh stability rintlak tak a tichiang a ni.

Dual-OS Flexibility: Windows & Linux lama hman theih a ni

Windows OS chu a productivity ecosystem nghet tak atan leh Linux chu open-source adaptability atan thlang rawh. Seamless cross-system switching hian enterprise mamawh hrang hrang a phuhruk a, nitin office hnathawh dan atanga custom development workflow thlengin a huam a ni.

Dual Display Output: HDMI & VGA hmanga inzawmkhawm a ni

HDMI leh VGA interface pahnih hmanga thuam a nih avangin high-definition visuals chu display tam takah a rualin a thawn thei a ni. Legacy leh tunlai device-te nena inmil lo taka a awm theih nan, enterprise presentation leh multi-screen collaborative workflows atan a tha ber a ni.

Scalable Memory & Storage Configuration te chu a hnuaia mi ang hian a ni

Operational demand bik ang zela RAM leh hard drive capacities configurable pe thei. Office hnathawh bulpui atanga high{1}}intensity operation thlenga hnathawh tur support turin resources te chu seamless takin scale la, optimized performance leh data storage tam tak a awm theih nan.

12th–14th Gen Intel Motherboard siam dan tur ruahmanna siam a ni

Intel-in 12th to 14th generation motherboard option aṭangin thlang la, processing capabilities tihchangtlun chu unlock rawh. Performance mamawh danglam zel nena inmil taka insiamrem, seamless multitasking leh hmalam hun-proofed enterprise operations neih theihna tur.

Compact OPS Unit: Hmun-Design tha ber
180mm×195mm×30mm a sei a ni a, he OPS computer hian profile compact tak a nei a ni. A streamlined, pluggable form factor hian smart board-ah seamless integration a siam a, educational leh conference environment-a space hman dan a ti tha hle.